超微X11SPI-TF 第二代志强单路主板

Key Features

1. 2nd Gen Intel® Xeon® Scalable Processors and Intel® Xeon® Scalable Processors, , Single Socket LGA-3647 (Socket P) supported, CPU TDP support Up to 205W TDP

2. Intel® C622

3. Up to 2TB 3DS ECC RDIMM, DDR4-2933MHz; Up to 2TB 3DS ECC LRDIMM, DDR4-2933MHz, in 8 DIMM slots

4. 
   

• Expansion slots:

• 1 PCIe 3.0 x16,

• 1 PCIe 3.0 x16 (x16 || x8),

• 1 PCIe 3.0 x8 (x0 || x8),

• 1 PCIe 3.0 x8,

• 1 PCIe 3.0 x4 (in x8)